公司介绍
鼎芯半导体公司成立于2002年，是中国首家射频集成电路设计创新企业，总部设在上海浦东张江高科技园区。 公司产品涵盖射频收发器等各类混合信号集成电路芯片，应用于手机和便携式多媒体产品。鼎芯的使命是为中国巨大的无线通讯市场和厂家提供先进的射频集成电路核心技术、强大的本土支持和紧密的战略联盟与合作。
公司主要投资方包括世界著名风险投资机构，如英特尔创投（Intel Capital）等，以及国际半导体业界的数位领军人物。
鼎芯半导体的核心团队在高通(Qualcomm)、IBM、国家半导体（NSC）、英特尔（Intel）、 联合半导体（RFMD）、美国模拟器件公司（ADI）、英飞凌（Infineon）、中兴通讯（ZTE）、华为、安捷伦（Agilent）、美信（Maxim）和冲电气实业（OKI）等著名国际芯片公司积累了丰富的经验。此外，鼎芯还承担了多项国家级的高科技研发项目，包括多项国家“863”计划项目和科技部创新项目等。
Company Profile
Established in 2002, Comlent, a fabless radio frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang Hi-tech Park, China, is a leading fabless RFIC design house that focuses on China’s explosive wireless communication and consumer electronics markets. Products of Comlent include RFIC transceivers and mixed signal ICs for mobile handsets and portable multimedia products. Comlent provides enabling RFIC technology, strong support and quality service to serve this fastest growing wireless communication market in China.
Investors of Comlent include world-famous venture capital institutions such as Intel Capital etc. and some individual investors with international industry background. Core team members of Comlent are semiconductor professionals used to work with Qualcomm , IBM, National Semiconductor, RFMD in the US and Huawei, ZTE, Intel, Agilent，ADI, Maxim and OKI in China. The value of the company lies in the combination of the potential of Greater China’s already largest but still exponentially growing wireless markets, accumulation of experienced RFIC product development and engineering team, and Comlent’s proposition and dedication to provide strong support for local innovation, time-to-market and cost reduction.
